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Semiconductor Wafer of Inspection System Laser Technology

Introducing Semiconductor Wafer of Inspection System Laser Technology the new Surf Scan SP2XP, a new IC wafer inspection system monitor, which has been successfully base on its predecessor tool of the same name. The new wafer inspection system has improve the sensitivity to defects in silicone, poly and metal films. It also has the ability to classify defects by type and size. This new semiconductor board inspection system laser technology also features vacuum handling and best-in-class performance. This system is design and manufacture to make it easy for chipmakers to bring their devices to market with superior quality and in minimal time. This system laser technology has a built-in ultra-high-sensitivity mode of operation to accelerate the next-generation because device development process. info technology hub

System Laser Technology

System Laser Technology

Laser technology higher speed

This SP2 system laser technology is design for nodes 65 and 45 nm and below. This slides into new UV laser technology, dark field optics, and advance algorithms. This tool is design to continuously provide accurate and reliable defects on but also construct substrates. This tool is design to detect defect patterns of 6 nm or more in multiplayer wafer patterns at a relatively system laser technology higher speed. The false alarm rate is design to be less than 0.5 occurrences per second. Chip. Performance is achieve by optical configuration and digital design pattern data. The main function of the digital design pattern data is to isolate defective areas in different layers to facilitate the isolation of defects.

Laser technology defects at a video speed of 7 megahertz

The image is process in one go by an image processor that is structure in a high-speed pipeline and can detect system laser technology defects at a video speed of 7 megahertz. This semiconductor wafer inspection system laser technology is design to meet the needs of rapid detection of defective materials so that the problem can be solve more quickly. Because faster is wafer scrap, interest rate losses and market lag. This technology is believed to actually improve the production of because leading devices with minimal defects in a short period of time.

Monitor wafer inspection system laser technology include a six percent increase in capacity

The benefits of the surfscan SP2XP monitor wafer inspection system laser technology include a six percent; increase in capacity due to changes in optomechanics, electronics and software. The multi-channel architecture allows the wafer ;inspection system to automatically separate microscope particles, cavities, watermarks, etc. The ultra-high sensitivity mode allows there are also system laser technology to be use for next-generation chip development. The introduction of optomechanics has been shown to be effective; in detecting defects even on rough films. The new contrast channel with differentiate interference allows the collection of low, flat and faint defects, which can result in device failure in advance devices. The error size function enables the system laser technology detection of because defects at higher speeds with greater precision.

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